Sure enough, my designer had changes – enough to keep me busy until 1PM. Round 2 of the chip is now done. The two of us discussed moving pads as I was headed out the door — bonding was suddenly an issue. My replacement thought she had a bond-out, but had never worked with our much more conservative packaging house before. Our packaging guys wouldn’t accept her bond-out. I had told her this a week ago, but she didn’t believe me. On Monday, I’ll move the pads and send out another bonding diagram request. This one will get through.
Looks like I’ll be working about half a week at my former company, and then I’m done; maybe forever. I meet with company #3 on Thursday next week. I haven’t heard from company #2. Maybe they are trying to do the layout themselves. If they can, it would save them money.
In the evening time, I drove my daughter to gymnastics and back again, and then we went to a talent show at her middle school. Wow, many of these 7th and 8th graders were really good… and a few weren’t.
Day 138 mood: Yeah, Friday!